Title:
MOLDING DIE AND MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2018001492
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a molded die capable of preventing poor molding of resin components by securing a degassing passage.SOLUTION: Provided is a molding die 1 including a fixing die 2 where a light guide lens (a first component) 11 is disposed and a movable die 3 that forms a cavity 6 with the light guide lens 11 disposed in the fixing die 2, which molds a base plate (a second component) 12 by solidifying a molten resin filled inside the cavity 6 of the movable die 3 with the light guide lens 11 being loaded in the fixing die 2 to manufacture a self-illuminating type panel (a composite component) 10 in which the base plate 12 and the light guide lens 11 are integrated. In the molding die, through-holes 2c, 11c for allowing the cavity 6 of the movable die 3 to communicate with the air are formed in the fixing die 2 and the light guide lens 11 disposed therein, and a pin 4 is inserted into the through-holes 2c, 11c to configure the gap between the two as a degassing passage 5.SELECTED DRAWING: Figure 4
Inventors:
MAENO SHOZO
Application Number:
JP2016128734A
Publication Date:
January 11, 2018
Filing Date:
June 29, 2016
Export Citation:
Assignee:
STANLEY ELECTRIC CO LTD
International Classes:
B29C45/26; B29C33/10; B29C45/14
Domestic Patent References:
| JP2015204228A | 2015-11-16 | |||
| JP2012218331A | 2012-11-12 | |||
| JP2004195853A | 2004-07-15 | |||
| JPH06166064A | 1994-06-14 |
Attorney, Agent or Firm:
Ryoichi Yamashita
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