Title:
遊技機
Document Type and Number:
Japanese Patent JP7319556
Kind Code:
B2
Abstract:
To make a main chip difficult to forge, and to thereby heighten security.SOLUTION: A top surface of a main chip 55 has multiple step parts 55c (semicircular spot), step parts 55d (circular spot displaying figure [1] inside), and step parts 55i (inside a line of a company name 55h). The step parts 55c, 55d, 55i have each different dent amount, respectively. Further, a product name 55g is displayed so as to straddle the step parts 55i (so as to hang over both of the step parts 55i and a flat surface.SELECTED DRAWING: Figure 318
Inventors:
Akio Date
Takuya Sakai
Takuya Sakai
Application Number:
JP2021039361A
Publication Date:
August 02, 2023
Filing Date:
March 11, 2021
Export Citation:
Assignee:
Sammy Corporation
International Classes:
A63F5/04
Domestic Patent References:
| JP2005168877A |
Attorney, Agent or Firm:
Tadashi Nakamura