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Title:
封着材料層付きガラス部材とそれを用いた電子デバイスおよびその製造方法
Document Type and Number:
Japanese Patent JP5598469
Kind Code:
B2
Abstract:
The purpose of the present invention is to suppress cracking and breaking of a glass substrate and to suppress separation of a thin film that is formed on the surface of the glass substrate, when the glass substrate is subjected to local heat sealing such as laser sealing. Specifically, a glass substrate (3) has a sealing region. The sealing region is provided with a sealing material layer (5) which is composed of a fired layer of a sealing glass material that contains a sealing glass, a low expansion filler and an electromagnetic wave absorbing material. The sealing material layer (5) contains 10-30% by volume of air bubbles, while containing 50-200 ppm by mass of carbon. The glass substrate (3) and a glass substrate (2), which has an element formation region that is provided with an electronic element, are laminated, and then the space between the glass substrates (2, 3) is sealed by melting the sealing material layer (5) by irradiating the sealing material layer (5) with an electromagnetic wave (6) such as laser light.

Inventors:
Sohei Kawanami
Ide Asahi
Application Number:
JP2011512365A
Publication Date:
October 01, 2014
Filing Date:
May 07, 2010
Export Citation:
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Assignee:
Asahi Glass Co., Ltd.
International Classes:
C03C8/24; C03C27/06; H01J9/26; H01J11/34; H01L31/0392; H01L51/50; H01M14/00; H05B33/04
Domestic Patent References:
JP2006524419A2006-10-26
JP2008115057A2008-05-22
JP2002366050A2002-12-20
JP2003068199A2003-03-07
Foreign References:
WO1998039789A11998-09-11
Attorney, Agent or Firm:
Patent business corporation cherry tree international patent firm