Title:
The glue film for tab lead closure consisting of the denaturation polyolefin system resin which has heat adhesiveness
Document Type and Number:
Japanese Patent JP6002441
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a tab lead sealing adhesive film comprising a modified polyolefin-based resin with thermal adhesiveness.SOLUTION: A tab lead sealing adhesive film is obtained by molding a modified resin in a film form using a T-shaped dice, the modified resin being a modified polyolefin-based resin which is obtained through graft modification using a monomer component including a compound including an ethylenic double bond and an epoxy group in the same molecular and has a melt flow rate (MFR) of 11.0-60.0 g/10 minutes.
Inventors:
Takeshi Sugiyama
Ryoji Nakayama
Kazuhito Wada
Ryoji Nakayama
Kazuhito Wada
Application Number:
JP2012116611A
Publication Date:
October 05, 2016
Filing Date:
May 22, 2012
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
H01M2/06; C08F255/00; C09J7/00; C09J151/06; H01M2/30
Domestic Patent References:
| JP6150894A | ||||
| JP2010212070A |
Attorney, Agent or Firm:
Atomi International Patent Office