Title:
研削装置
Document Type and Number:
Japanese Patent JP7349901
Kind Code:
B2
Abstract:
To provide a grinding apparatus which can easily confirm the diameter of a recess.SOLUTION: A grinding apparatus 1 includes: a chuck table 10; a rough grinding unit 30 which grinds a wafer 100 held by the chuck table 10 with a grinding wheel 33 so as to form a circular rough recess and form an annular projection at an outer peripheral edge of the rough recess; an advance/retreat unit 35 which advances/retreats the rough grinding unit 30 in a radial direction of the chuck table 10; a grinding feed unit 36 which performs grinding feed of the rough grinding unit 30 in a direction perpendicular to a holding surface 11 of the chuck table 10; a measuring section 50 which includes a camera 51 for determining a coordinate of an inner peripheral edge of the projection from image information obtained by photographing the projection and calculating the diameter of the rough recess from the coordinate; a calculation section 60 which determines a difference between the diameter of the rough recess calculated by the measuring section 50 and a preset target value; and a control unit 70 which corrects the position of the rough grinding unit 30 in the advance/retreat unit 35 on the basis of the difference determined by the calculation section 60.SELECTED DRAWING: Figure 1
Inventors:
Yuya Matsuoka
Shigenori Harada
Kiyoshi Fujimura
Suguru Okamura
Chika Mori
Keisuke Yamamoto
Shigenori Harada
Kiyoshi Fujimura
Suguru Okamura
Chika Mori
Keisuke Yamamoto
Application Number:
JP2019232756A
Publication Date:
September 25, 2023
Filing Date:
December 24, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B49/12; B24B5/01; B24B7/04; B24B9/00; G01B11/08; G01B11/26; G01B11/30; H01L21/304
Domestic Patent References:
| JP201551479A | ||||
| JP201860873A | ||||
| JP2010147134A | ||||
| JP2009123790A | ||||
| JP201869348A |
Attorney, Agent or Firm:
Sakai International Patent Office