Title:
研削装置
Document Type and Number:
Japanese Patent JP7382840
Kind Code:
B2
Abstract:
To provide a grinding device that can suppress the difficulty in replacing a grinding wheel.SOLUTION: In a grinding device 1, grinding units 3, 4 are provided at the lower end part of a spindle. The grinding device comprises a wheel engagement part that engages with an annular base 34 of grinding wheels 32, 42 and fixes the grinding wheels 32, 42 to the spindle, and an engagement part positioning mechanism that positions the wheel engagement part at an engagement position where it engages with the annular base 34 and a retract position where it retracts from the annular base 34. When the grinding wheels 32, 42 are mounted on the grinding units 3, 4, a control unit 100 moves a grinding wheel chuck table 7-1 on which the grinding wheels 32, 42 are mounted, to grinding areas 302, 303, and after grinding and feeding the grinding units 3, 4 to bring the wheel engagement part closer to the grinding wheels 32, 42, positions the wheel engagement part at the engagement position, and mounts the grinding wheels 32, 42 on the grinding units 3, 4.SELECTED DRAWING: Figure 1
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Inventors:
Masayuki Takahashi
Yoshihiro Omuro
Shigeru Ishii
Ryo Mizushima
Yoko Hiraga
Daiki Abe
Keisuke Hanaoka
Shinichiro Hori
Yoshihiro Omuro
Shigeru Ishii
Ryo Mizushima
Yoko Hiraga
Daiki Abe
Keisuke Hanaoka
Shinichiro Hori
Application Number:
JP2020005518A
Publication Date:
November 17, 2023
Filing Date:
January 16, 2020
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B45/00; B24B7/04; B24B41/06; B24B47/22; H01L21/304
Domestic Patent References:
| JP2015226945A | ||||
| JP2019055460A | ||||
| JP2019517931A | ||||
| JP50008177A |
Attorney, Agent or Firm:
Sakai International Patent Office