GRINDING METHOD OF PACKAGE SUBSTRATE

Japanese Patent JP2016078218

A

PROBLEM TO BE SOLVED: To provide a grinding method of a package substrate which can thin a sealing resin layer of the package substrate to a desired thickness by one cutting device even without a grinding device.SOLUTION: The grinding method includes: a protection member sticking process of sticking a front surface 11a side of the package substrate on a protection member integrally mounted on an annular frame; a holding process of sucking and holding the front surface side of the package substrate with the protection member stuck by a chuck table of a cutting device; a first grinding process of grinding a sealing resin layer of the package substrate to a first thickness by relatively moving a first flat grinding wheel and the package substrate in a grind feed direction while contacting the first flat grinding wheel with a sealing resin layer 29 on a rear surface 11b side of the package substrate after carrying out the holding process; and a second grinding process of finish-grinding the sealing resin layer of the package substrate to the desired thickness by relatively moving a second flat grinding wheel and the package substrate in the grind feed direction while contacting a second flat grinding wheel 44B with the sealing resin layer on the rear surface side of the package substrate after carrying out the first grinding process.SELECTED DRAWING: Figure 8

SUGITANI TETSUKAZU
TSUTSUMI YOSHIHIRO
KURIMURA SHIGEYA

JP2014215188A

May 16, 2016

October 22, 2014

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DISCO ABRASIVE SYSTEMS LTD

B24B7/02; B24B7/30

JP2011181641A	2011-09-15
JP2004291157A	2004-10-21
JP2006032471A	2006-02-02
JP2013197591A	2013-09-30
JPS5015493U	1975-02-18
JP2009130173A	2009-06-11

Akira Matsumoto
Tomohiro Okamoto

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