Title:
A hardenability flux constituent and the soldering method
Document Type and Number:
Japanese Patent JP5957213
Kind Code:
B2
Abstract:
A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) hydrogen; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.
Inventors:
David Dee. Fleming
Mike K. Gallagher
Kim San Ho
Mark Earl Winkle
Shan-Chin Liu
Mike K. Gallagher
Kim San Ho
Mark Earl Winkle
Shan-Chin Liu
Application Number:
JP2011260178A
Publication Date:
July 27, 2016
Filing Date:
November 29, 2011
Export Citation:
Assignee:
Rohm and Haas Electronic Materials LLC
International Classes:
C08G59/50; C08L63/00; H01L21/60
Domestic Patent References:
| JP2008069352A | ||||
| JP62265323A |
Foreign References:
| US20080051524 | ||||
| US6627683 | ||||
| US20020089067 |
Attorney, Agent or Firm:
Patent Business Corporation Sender International Patent Office