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Title:
ヒートポンプサイクル装置
Document Type and Number:
Japanese Patent JP7379846
Kind Code:
B2
Abstract:
To provide a heat pump cycle device suppressing deterioration of a COP value.SOLUTION: When a heat pump cycle device 100 is performing a heating operation, an opening of an expansion valve 4 is adjusted in order to set an actual refrigerant supercooling degree to become a target refrigerant supercooling degree. At this time, a return temperature detected by a return temperature sensor 59 and a refrigerant outlet temperature detected by a refrigerant temperature sensor 55 are compared to each other, and in accordance with this comparison result, the target refrigerant supercooling degree is corrected. Specifically, when a supercooling degree difference obtained by subtracting the target refrigerant supercooling degree from the actual refrigerant supercooling degree is a value within a predetermined range and a temperature difference obtained by subtracting the return temperature from the refrigerant outlet temperature is a value larger than a first predetermined value, a correction target refrigerant supercooling degree is calculated by adding a second predetermined value to the target refrigerant supercooling degree. Then, in order to set the actual refrigerant supercooling degree to become the correction target refrigerant supercooling degree, the opening of the expansion valve 4 is adjusted.SELECTED DRAWING: Figure 3

Inventors:
Toshihisa Tomita
Masanori Noguchi
Application Number:
JP2019063187A
Publication Date:
November 15, 2023
Filing Date:
March 28, 2019
Export Citation:
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Assignee:
Fujitsu General Limited
International Classes:
F25B1/00; F24D3/00; F24F11/84; F25B30/02
Domestic Patent References:
JP2013127332A
JP2011069570A
JP2016068687A
JP3148564A