A heat relay, a heating cooling device, a heat cycle injection-molding device, and a heat cycle injection molding method - Japan Aviation Electronics Industry Co., Ltd.

Title:

A heat relay, a heating cooling device, a heat cycle injection-molding device, and a heat cycle injection molding method

Document Type and Number:

Japanese Patent JP6058253

Kind Code:

B2

Inventors:

Fukuda Takuma

Application Number:

JP2011031068A

Publication Date:

January 11, 2017

Filing Date:

February 16, 2011

Export Citation:

Assignee:

Japan Aviation Electronics Industry Co., Ltd.

International Classes:

F28D15/02; B29C45/73

Domestic Patent References:

Attorney, Agent or Firm:

Naoki Nakao
Yukio Nakamura
Yoshimura Munehiro

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