Title:
Height detection method for bonding equipment and objects to be bonded
Document Type and Number:
Japanese Patent JP6330162
Kind Code:
B2
Abstract:
A bonding apparatus having an optical system, an imaging element for acquiring an image formed by the optical system as a picture, an illumination unit for illuminating an electronic component, and a control part for processing the image acquired by the imaging element, the control part illuminating the electronic component through a first inclined optical path inclined with respect to the optical axis of a first portion of the optical system facing the electronic component and acquiring a first image, illuminating the electronic component through a second inclined optical path inclined toward the opposite side from the first inclined optical path with respect to the optical axis and acquiring a second image of the electronic component as a subject, and calculating an amount of variation from a reference height of the electronic component on the basis of the positional offset amount between the first image and the second image.
Inventors:
Shigeru Hayada
Tomiyama Hiromi
Tomiyama Hiromi
Application Number:
JP2016227938A
Publication Date:
May 30, 2018
Filing Date:
November 24, 2016
Export Citation:
Assignee:
Shinkawa Co., Ltd.
International Classes:
G01B11/06; G03B15/00; G03B15/02; H01L21/52; H01L21/60; H04N5/225
Domestic Patent References:
| JP2012038992A | ||||
| JP2001108418A | ||||
| JP2013205407A | ||||
| JP2008164324A |
Foreign References:
| WO1998051993A1 | ||||
| US20050094865 |
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office
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