Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ホットスタンプ装置
Document Type and Number:
Japanese Patent JP7196820
Kind Code:
B2
Abstract:
Provided is a novel hot stamp device capable of reducing a cost required for hot stamping. The hot stamp device is provided with a supporting mold for supporting a substrate from a back side; a robot arm having a multi-joint arm with a clamp at its front end, and an arm driving element for driving the multi-joint arm; and a hot stamp unit detachably held on the clamp of the robot arm. The hot stamp unit is provided with an unwinding roller around which a transfer film having a carrier film and an appearance layer formed on the carrier film is wound; a winding roller on which a carrier film of the transfer film is mounted; a roller driving element that rotates the unwinding roller and the winding roller to unwind the transfer film from the unwinding roller and wind the carrier film around the winding roller; a heating element that heats the appearance layer of the transfer film; and a pressing transfer element that is disposed on the carrier film side of the transfer film between the unwinding roller and the winding roller, and that presses the transfer film toward the appearance layer side.

More Like This:
Inventors:
Motoshi Ogisu
Yujiro Ishigami
Application Number:
JP2019204184A
Publication Date:
December 27, 2022
Filing Date:
November 11, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Toyoda Gosei Co., Ltd.
International Classes:
B41F16/00; B44C1/17
Domestic Patent References:
JP2016145052A
JP2017119400A
JP2008307635A
JP10203095A
JP7304157A
JP4135933U
Foreign References:
US20060266795
DE202007006247U1
Attorney, Agent or Firm:
Patent Attorney Corporation Kyoritsu Patent Office