Title:
IMAGING APPARATUS AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2017174994
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To hinder warping of a substrate.SOLUTION: An imaging apparatus comprises a stack of a first structure in which a pixel array part is formed; and a second structure in which an input/output circuit part and a signal processing circuit are formed, the input/output circuit part being configured to input a predetermined signal from an external part of the apparatus and to output a pixel signal, output from a pixel, to the external part of the device. The image forming apparatus disposes, below the pixel array part: a signal output external terminal connected with the external part via a first through-hole via extending through a semiconductor substrate in the second structure; and a signal input external terminal connected with the external part via a second through-hole via connected to an input circuit part and extending through the semiconductor substrate. The signal output external terminal is electrically connected with the first through-hole via through first re-wiring. The signal input external terminal is electrically connected with a second through-hole via through second re-wiring. Electrically independent third re-wiring is disposed in the same layer as the first re-wiring and the second re-wiring. This disclosure can be applied in, for example, an imaging apparatus.SELECTED DRAWING: Figure 50
More Like This:
Inventors:
ISHIWATARI HIROAKI
TANAKA HARUMI
ANDO ATSUHIRO
TANAKA HARUMI
ANDO ATSUHIRO
Application Number:
JP2016059978A
Publication Date:
September 28, 2017
Filing Date:
March 24, 2016
Export Citation:
Assignee:
SONY CORP
International Classes:
H01L27/14; H01L27/146; H04N5/361; H04N5/369
Attorney, Agent or Firm:
Takashi Nishikawa
Yoshio Inamoto
Yoshio Inamoto