INJECTION MOLDING APPARATUS AND INJECTION MOLDING METHOD

Japanese Patent JP2016203435

A

PROBLEM TO BE SOLVED: To provide an injection molding apparatus and method for suppressing the temperature of a resin material in the injection molding apparatus.SOLUTION: An injection molding apparatus 1 comprises a mold device 2 and an injection molding machine 3. The mold device 2 includes a hot runner device 16. The injection molding machine 3 has a plasticization mechanism 4 and an injection mechanism 5. A control system 7 controls heaters 19, 25, 29, 35 so that the temperature of a resin material at an outlet of the hot runner device 16, that is, the temperature of the resin material at a gate becomes an injection temperature suitable for injection molding to a cavity 12. The control system 7 controls the heaters 25, 29, 35 so that the temperature of the resin material at an inlet of the hot runner device 16, that is, the temperature of the resin material at a nozzle 34 becomes lower than the injection temperature. The control system 7 controls the heater 25 so that the temperature of the resin material at an outlet of the plasticization mechanism 4, that is, the temperature of the resin material at a nozzle 24 becomes lower than the injection temperature.SELECTED DRAWING: Figure 1

SUZUKI MAKOTO
ARAI TAKESHI
NAGANO YASUNARI

JP2015085311A

December 08, 2016

April 17, 2015

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DENSO CORP

B29C45/78; B29C45/27

JPH0639882A	1994-02-15
JP2012136018A	2012-07-19
JPS5948822U	1984-03-31

Kazuyuki Yahagi
Taihei Nonobe
Takanori Kubo

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