Title:
An insulating adhesive composition and a circuit board
Document Type and Number:
Japanese Patent JP6013118
Kind Code:
B2
Inventors:
Yusuke Taniguchi
Ishigaki Koichi
Jun Aoki
Yoshinobu Sugisawa
Toshiaki Shimada
Ishigaki Koichi
Jun Aoki
Yoshinobu Sugisawa
Toshiaki Shimada
Application Number:
JP2012218290A
Publication Date:
October 25, 2016
Filing Date:
September 28, 2012
Export Citation:
Assignee:
TAMURA CORPORATION OF CHINA LIMITED
International Classes:
C09J163/00; C09J11/06; C09J11/08; H01L21/60
Domestic Patent References:
| JP4088337B2 | ||||
| JP2012238699A | ||||
| JP2002069414A |
Foreign References:
| WO2007129662A1 |
Attorney, Agent or Firm:
Intellectual Property Office
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