Title:
An integrated circuit, electronic equipment, a solid imaging device, an imaging device
Document Type and Number:
Japanese Patent JP6065046
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To suppress an increase in the total area of a substrate in a semiconductor integrated circuit in which an analog circuit and a digital circuit are mixed.SOLUTION: A semiconductor integrated circuit 1 comprises: an analog circuit 13; and a digital circuit 14 that converts an analog output signal from the analog circuit 13 into a digital signal. A part 19 of the analog circuit is formed on a first semiconductor substrate 51, and the other part 37 of the analog circuit and the digital circuit 14 are formed on a second semiconductor substrate 53. The first semiconductor substrate 51 and the second semiconductor substrate 53 are connected by a substrate connection portion 55. The substrate connection portion 55 transmits the analog signal generated by the part 19 of the analog circuit to the second semiconductor substrate 53.
Inventors:
Yoshiharu Kudo
Application Number:
JP2015085981A
Publication Date:
January 25, 2017
Filing Date:
April 20, 2015
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L27/14; H01L27/146; H04N5/369
Domestic Patent References:
| JP2009170448A | ||||
| JP2002043556A | ||||
| JP2008005155A | ||||
| JP2009147004A | ||||
| JP2006049361A | ||||
| JP2002044527A |
Foreign References:
| WO2010073520A1 |
Attorney, Agent or Firm:
Takahisa Sato
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