Title:
一対の離間された構造部材上に形成された一対のマイクロ波伝送線路を電気接続するインターコネクト構造
Document Type and Number:
Japanese Patent JP7023287
Kind Code:
B2
Abstract:
A structure having pair of structure members separated by a gap and an interconnect structure member disposed in the gap. The interconnect structure member includes: a fill-structure having opposing sides in direct contact with the opposing sides of the first structure member and the second structure member; and, an interconnecting microwave transmission line disposed on the fill-structure electrically interconnecting the microwave transmission line of the first structure member to the second member structure. An electrically conductive member is disposed over a signal line of, and electrically connected to the ground conductor the interconnecting microwave transmission.
Inventors:
Trulli, Susan, Sea.
Ryton, Christopher, M.
Harper, Elysia, Kay.
Ryton, Christopher, M.
Harper, Elysia, Kay.
Application Number:
JP2019540054A
Publication Date:
February 21, 2022
Filing Date:
January 22, 2018
Export Citation:
Assignee:
Raytheon Company
International Classes:
H01P5/02; H01P1/04; H01P11/00; H05K1/14; H05K3/36
Domestic Patent References:
| JP2011061585A | ||||
| JP2008227720A | ||||
| JP4223703A | ||||
| JP10242715A | ||||
| JP2002057529A | ||||
| JP2016178361A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Onuki
Tadahiko Ito
Shinsuke Onuki
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