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Title:
JUNCTION DEVICE, JUNCTION METHOD USING THE SAME, AND MANUFACTURING METHOD FOR JUNCTION BODY
Document Type and Number:
Japanese Patent JP2018069269
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a junction device capable of continuous junction on friction heat in a simple structure and excellent in junction quality, a junction method using the same, and a manufacturing method for a junction body.SOLUTION: This invention comprises a movable junction tool, a pair of a first fixture and a second fixture for holding and fixing a material to be fixed each on both ends of the movable junction tool, the movable junction tool having a movement mechanism for movement along between the materials to be fixed on both the ends, and the first fixture and the second fixture having a pressurization control mechanism where the materials to be each held and fixed pressurize the movable junction tool and control pressure contact with each other.SELECTED DRAWING: Figure 1

Inventors:
SHIBAYANAGI TOSHIYA
ISHIHARA SATORU
HIROSE SHUHEI
SATO SATOSHI
Application Number:
JP2016210099A
Publication Date:
May 10, 2018
Filing Date:
October 27, 2016
Export Citation:
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Assignee:
UNIV TOYAMA
International Classes:
B23K20/12
Domestic Patent References:
JP2002224856A2002-08-13
JPH07505090A1995-06-08
JP2010214388A2010-09-30
JPS57149082A1982-09-14
JPH10193139A1998-07-28
JPS4738556A
Attorney, Agent or Firm:
Kaichi Otani