A joining structure object and a semiconductor manufacturing device using this

Title:

A joining structure object and a semiconductor manufacturing device using this

Document Type and Number:

Japanese Patent JP6234076

Kind Code:

B2

Inventors:

Yu Suzuki
Kazuhisa Toyofuku

Application Number:

JP2013127026A

Publication Date:

November 22, 2017

Filing Date:

June 17, 2013

Export Citation:

Assignee:

Maruwa corporation

International Classes:

H01L21/683; H02N13/00

Domestic Patent References:

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