Title:
接合物
Document Type and Number:
Japanese Patent JP7270262
Kind Code:
B2
Abstract:
Provided is a bonded object in which deformation due to bonding of a main body section and a tip section does not easily occur. A bonded object (10) is provided with a main body section (100), a tip section (200), and a bonded section (300). The main body section (100) supports the tip section (200). The tip section (200) acts on an object. The bonded section (300) bonds the main body section (100) and the tip section (200). The bonded section (300) includes a fitting portion (310), an insertion structure (320), and a restriction structure (330). The fitting portion (310) comprises a main body fitting part (120) and a tip fitting part (220). The insertion structure (320) is configured such that the main body fitting part (120) and the tip fitting part (220) are fitted by relative movement of the main body section (100) and the tip section (200) in the height direction. The restriction structure (330) is configured so as to restrict the relative movement of the main body section (100) and the tip section (200) in the intersecting direction in the fitted state.
Inventors:
Yosuke Hiraguri
Keiichi Inoue
Kazuma Iizawa
Takahiro Shirasawa
Keiichi Inoue
Kazuma Iizawa
Takahiro Shirasawa
Application Number:
JP2020219539A
Publication Date:
May 10, 2023
Filing Date:
December 28, 2020
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B23P11/00; F16B5/07; F16B11/00
Domestic Patent References:
| JP2007181891A | ||||
| JP2017202557A | ||||
| JP2007255652A | ||||
| JP2006289472A | ||||
| JP2003080329A | ||||
| JP7285055A | ||||
| JP59173810U |
Foreign References:
| US20080277026 | ||||
| FR1522955A |
Attorney, Agent or Firm:
Koji Fukui