Title:
接合構造体
Document Type and Number:
Japanese Patent JP7268500
Kind Code:
B2
Abstract:
Provided is a joint structure having excellent thermal shock resistance and a high joint strength. A joint structure according to an embodiment of the present invention is provided with: a first member that is made of a metal material and has a plurality of holes formed in the surface thereof and having opening diameters of 30-100 µm; a third member that is made of a thermoplastic resin or a metal material which is the same as or different from that of the first member and that has a plurality of independent holes formed in the surface thereof and having opening diameters of 3-100 µm; and a second member that is made of a curable resin and joins the surface in which the holes of the first member are formed and the surface in which the holes of the third member are formed.
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Inventors:
Daisuke Sato
Application Number:
JP2019117718A
Publication Date:
May 08, 2023
Filing Date:
June 25, 2019
Export Citation:
Assignee:
OMRON Corporation
International Classes:
B32B3/30; B29C65/48; B32B7/12; B32B15/08; B32B15/092; F16B5/08; F16B11/00
Domestic Patent References:
| JP2008087409A | ||||
| JP2010113938A | ||||
| JP2004153018A |
Foreign References:
| WO2011071061A1 | ||||
| WO2015008771A1 | ||||
| WO2016133079A1 |
Other References:
2 接着剤概説(接着剤を支える基本技術の概説),国立科学博物館技術の系統化調査報告,2012年08月,Vol.17,p.368-382,https://sts.kahaku.go.jp/diversity/document/system/pdf/075.pdf
Attorney, Agent or Firm:
Murakami
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