Title:
レーザーダイシング方法、チップの製造方法およびレーザー加工装置
Document Type and Number:
Japanese Patent JP5598801
Kind Code:
B2
Inventors:
劉 洪春
Maruyama 創
Maruyama 創
Application Number:
JP2012275712A
Publication Date:
October 01, 2014
Filing Date:
December 18, 2012
Export Citation:
Assignee:
Incorporated company laser system
International Classes:
H01L21/301; B23K26/00; B23K26/40; B28D5/00
Attorney, Agent or Firm:
Koichi Washida