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Title:
A layered product, a constituent for protection layer formation, a kit, and a manufacturing method of a semiconductor device
Document Type and Number:
Japanese Patent JP6188614
Kind Code:
B2
More Like This:
WO/2015/186625METHOD FOR PRODUCING SEMICONDUCTOR HAVING GETTERING LAYER, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
JP2000082731CLEAN ROOM FACILITY
Inventors:
Masashi Yoshida
Ichiro Koyama
Application Number:
JP2014066386A
Publication Date:
August 30, 2017
Filing Date:
March 27, 2014
Export Citation:
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Assignee:
FUJIFILM Corporation
International Classes:
H01L21/02; B32B27/00; C08L101/12; C09D7/12; C09D125/04; C09D125/10; C09D153/02; C09D201/00; H01L21/304; H01L21/683
Domestic Patent References:
JP2008060255A
JP2012062405A
JP2013503366A
JP2010225676A
JP2012188650A
JP2013120805A
JP2012124467A
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes



 
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