Title:
A layered product and its application
Document Type and Number:
Japanese Patent JP6182491
Kind Code:
B2
Abstract:
Provided are a temporary bonding layer laminate for producing a semiconductor device, which can reliably and easily provide a temporary support for the device wafer when the device wafer is subjected to a mechanical or chemical treatment and can easily provide a release from the temporary support for the device wafer while not damaging the device wafer even after undergoing a process at a high temperature; and a composition for forming a protective layer, a composition for forming a release layer, and a kit, each of which is used for the production of the laminate. The laminate has a device wafer, a protective layer, a release layer, and a support substrate in this order, in which the protective layer is in contact only with the device wafer and the release layer, the release layer is in contact only with the protective layer and the support substrate, and the release layer contains a fluorine atom and/or a silicon atom.
Inventors:
Ichiro Koyama
Yu Iwai
Yoshiki Kamochi
Yu Iwai
Yoshiki Kamochi
Application Number:
JP2014066385A
Publication Date:
August 16, 2017
Filing Date:
March 27, 2014
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
C09D125/04; H01L21/02; C09D169/00; C09D183/04; C09D201/04; H01L21/683
Domestic Patent References:
| JP9190955A | ||||
| JP2010109324A | ||||
| JP2012524399A | ||||
| JP2012064710A |
Foreign References:
| WO2012057893A2 |
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes
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