Title:
LIQUID EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2017145357
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition which uses an amine-based curing agent that enhances Tg of an epoxy resin and is excellent in humidity resistance and thermal cycle resistance, and can suppress creeping.SOLUTION: A liquid epoxy resin composition contains (A) an epoxy resin, (B) an amine-based curing agent, and (C) specific dimethylpolysiloxane, and (C) the component is 0.01-0.30 pts.mass with respect to 100 pts.mass of the total of (A) the component and (B) the component. Preferably, the liquid epoxy resin composition contains (D) rubber particles.SELECTED DRAWING: None
Inventors:
KAMIMURA TAKESHI
HOSONO YOHEI
HOSONO YOHEI
Application Number:
JP2016029490A
Publication Date:
August 24, 2017
Filing Date:
February 19, 2016
Export Citation:
Assignee:
NAMICS CORP
International Classes:
C08L63/00; C08G59/50; C08K3/00; C08K5/17; C08K5/54; C08L21/00; C08L83/04; H01L23/29; H01L23/31
Domestic Patent References:
| JP2005272824A | 2005-10-06 | |||
| JP2012082281A | 2012-04-26 | |||
| JP2006282824A | 2006-10-19 | |||
| JP2007182560A | 2007-07-19 | |||
| JP2002146160A | 2002-05-22 |
Foreign References:
| WO2011013326A1 | 2011-02-03 |
Attorney, Agent or Firm:
Yusuke Watanabe
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