Title:
A manufacturing method of an adhesive composition, an adhesion sheet, and a semiconductor device
Document Type and Number:
Japanese Patent JP6250265
Kind Code:
B2
Abstract:
An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a coupling agent (C) having reactive a double bond group.
Inventors:
Sayaka Tsuchiyama
Isao Ichikawa
Isao Ichikawa
Application Number:
JP2012061097A
Publication Date:
December 20, 2017
Filing Date:
March 16, 2012
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
C09J7/35; C09J11/06; C09J133/00; C09J163/00; C09J163/10; H01L21/301
Domestic Patent References:
| JP2008133330A | ||||
| JP2010106244A |
Attorney, Agent or Firm:
Maeda/Suzuki International Patent Corporation
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