Title:
The manufacturing method of the carrier tape for electronic-parts storage, and the carrier tape for electronic-parts storage, and a packing object
Document Type and Number:
Japanese Patent JP6114514
Kind Code:
B2
Abstract:
The present invention provides a carrier tape for receiving electronic components. The carrier tape is a resin carrier tape having a band-like sheet and also having recesses disposed along the longitudinal direction of the band-like sheet. The recesses are formed in a first surface of the band-like sheet, and a second surface on the reverse side of the first surface is substantially flat. The edges of the recesses are curved at a radius of 0.2 mm or less. The present invention also provides: a method for manufacturing the carrier tape for receiving electronic components; and a package body.
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Inventors:
Eiji Okochi
Kazuo Tajiri
Kenichi Nakaetsu
Toshio Sugiyama
Kazuo Tajiri
Kenichi Nakaetsu
Toshio Sugiyama
Application Number:
JP2012176493A
Publication Date:
April 12, 2017
Filing Date:
August 08, 2012
Export Citation:
Assignee:
Shin-Etsu Polymer Co., Ltd.
International Classes:
B65D85/86; B29C48/08; B29C48/305; B29C59/04; B65B15/04; B65B47/04; B65D73/02
Domestic Patent References:
| JP2000185766A | ||||
| JP2011225256A | ||||
| JP2006117250A | ||||
| JP2004137080A | ||||
| JP8132515A |
Attorney, Agent or Firm:
Tatsuya Masuda
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