Title:
CIRCUIT BOARD ASSEMBLY, INSERT MOLDING PRODUCT AND PRODUCTION METHOD OF INSERT MOLDING PRODUCT
Document Type and Number:
Japanese Patent JP2017196855
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a circuit board assembly, an insert molding product and a production method of the insert molding product, which are capable of preventing connection terminals from contacting each other due to a whisker even when the whisker is generated from the connection terminal.SOLUTION: A cover body of a circuit board assembly includes a barrier 12 forming a plurality of grooves M that house respective connection terminals 27 for every connection terminal. Each of the barriers 12 suppresses advance of an inner surface of a second cover 50 of the cover body to the groove M, and prevents contact between adjacent connection terminals 27 when a whisker is generated, when an external pressure is applied to a site that covers the connection terminal 27 of the cover body.SELECTED DRAWING: Figure 2
Inventors:
TOYAMA YUICHI
Application Number:
JP2016091393A
Publication Date:
November 02, 2017
Filing Date:
April 28, 2016
Export Citation:
Assignee:
JTEKT CORP
International Classes:
B29C45/26; B29C45/14
Domestic Patent References:
| JP2000206130A | 2000-07-28 | |||
| JP2004327318A | 2004-11-18 | |||
| JP2008077916A | 2008-04-03 | |||
| JP2017147280A | 2017-08-24 | |||
| JP2005317293A | 2005-11-10 |
Foreign References:
| US20030040203A1 | 2003-02-27 |
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda