A manufacturing method of a conductive adhesion sheet, a wiring device, and a wiring device

Japanese Patent JP5928556

B2

　This electroconductive adhesive includes a thermosetting resin (A) having a carboxyl group, an epoxy resin (B), an elastomer (C) having a reactive functional group, an electroconductive filler (D), and a curing agent (E). Through this configuration, an electroconductive adhesive is obtained which, after curing, has heat resistance that is maintained at the solder reflow temperature, while the electroconductive adhesive is suitable for temporary bonding and has excellent punching workability. The electroconductive adhesive preferably includes 3-200 parts by weight of the elastomer (C) having a reactive functional group with respect to 100 parts by weight of the thermosetting resin (A) having a carboxyl group.

Nishinohara Satoshi
Hidenori Kobayashi
Kazunori Matsudo

JP2014226400A

June 01, 2016

November 06, 2014

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Toyo Ink sc Holdings Co., Ltd.
Toyochem Co., Ltd.

C09J163/00; C09J7/00; C09J9/02; C09J11/04; C09J11/06; C09J133/00; C09J161/04; C09J175/02; C09J175/04; C09J177/00; H01B1/20; H01B5/16; H05K1/02; H05K1/03

JP2003168323A
JP2009263590A
JP7157740A
JP2006124531A
JP11195326A
JP63280785A
JP2012149274A
JP2002368043A
JP2004352785A
JP2011111474A
JP2000100872A
JP2010143981A
JP2002285103A
JP2006318990A
JP2010219039A
JP2013125598A
JP2013143292A
JP4469089B2

WO2012011265A1
WO2000046315A1
WO2014003159A1
WO2014010524A1
WO2009090997A1
US20030144381
CN1427035A
KR1020040029932B1
CN101940080A
KR1020100107043B1
CN1339055A
KR1020040002810B1

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