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Title:
The manufacturing method of copper foil with a career, the manufacturing method of a copper-clad laminate sheet, the manufacturing method of a printed wired board, the manufacturing method of electronic equipment, copper foil with a career, a copper-clad laminate sheet, a printed wired board, and electronic equipment
Document Type and Number:
Japanese Patent JP5919345
Kind Code:
B2
Inventors:
Yuta Nagaura
Akimasa Moriyama
Tomoki Kobiki
Application Number:
JP2014174893A
Publication Date:
May 18, 2016
Filing Date:
August 29, 2014
Export Citation:
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Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
C25D1/04; B32B15/04; C25D1/22; H05K1/09; H05K3/46
Domestic Patent References:
JP2015193884A
JP2007512973A
JP2010272882A
JP2007152796A
JP2011068142A
Foreign References:
WO2014080958A1
Attorney, Agent or Firm:
Axis International Patent Business Corporation