Title:
A manufacturing method of copper foil with a career, a layered product, and a printed wired board, and a manufacturing method of electronic equipment
Document Type and Number:
Japanese Patent JP6006445
Kind Code:
B1
Abstract:
【課題】回路形成性が良好なキャリア付銅箔を提供する。【解決手段】キャリア、中間層、極薄銅層をこの順に有するキャリア付銅箔であって、極薄銅層の厚さ方向の単位断面積あたりの結晶粒個数が０．１〜５個／μｍ2であり、極薄銅層側表面の十点平均粗さＲｚが０．１〜２．０μｍであるキャリア付銅箔。【選択図】図５
Inventors:
Akimasa Moriyama
Yuta Nagaura
Yuta Nagaura
Application Number:
JP2016027055A
Publication Date:
October 12, 2016
Filing Date:
February 16, 2016
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
B32B15/20; B32B15/08; C25D3/38; C25D7/06; H05K1/03; H05K1/09; H05K3/20
Domestic Patent References:
| JP2005161840A | 2005-06-23 |
Foreign References:
| WO2015108191A1 | 2015-07-23 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation
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