Title:
A manufacturing method of copper terminal material with tin-plated
Document Type and Number:
Japanese Patent JP6226037
Kind Code:
B2
Abstract:
A method of manufacturing tin-plated copper terminal material as a terminal crimped to a terminal end of an electric wire made of an aluminum wire material, using a base member of copper or copper alloy in which galvanic corrosion is not easy to occur and an adhesiveness of a tin layer is excellent, the method includes: a zinc-nickel alloy layer forming step forming a zinc-nickel alloy layer having a nickel content of 5 mass% to 50 mass% inclusive and a thickness of 0.1 µm to 5.0 µm inclusive on a base member made of copper or copper alloy; and a tin-plating step forming a tin layer by tin plating on the zinc-nickel alloy layer; more preferably, following the tin-plating step, the method includes a diffusion treatment step diffusing zinc from the zinc-nickel alloy layer to the tin layer by maintaining at 40°C to 160°C inclusive for 30 minutes or longer.
Inventors:
Kenji Kubota
Keiya Tarutani
Kiyotaka Nakaya
Keiya Tarutani
Kiyotaka Nakaya
Application Number:
JP2016150740A
Publication Date:
November 08, 2017
Filing Date:
July 29, 2016
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
C25D5/12; C22C18/00; C22C19/03; C23C10/28; C25D5/50; C25D7/00; H01B13/00; H01R13/03; H01R43/16
Domestic Patent References:
| JP2000169996A | ||||
| JP2000144482A | ||||
| JP2003328157A | ||||
| JP8041681A | ||||
| JP11193494A | ||||
| JP2014164927A |
Foreign References:
| WO2013161125A1 |
Attorney, Agent or Firm:
Masakazu Aoyama