Title:
A manufacturing method of an electronic device, the drive using it, and an electronic device
Document Type and Number:
Japanese Patent JP6252550
Kind Code:
B2
Abstract:
An electronic device includes a circuit board, a heat sink and thermal gel. The circuit board has an electronic component, which is mounted to a first principal surface of the circuit board. The heat sink has an opposing surface, which is opposed to the first principal surface of the circuit board. The thermal gel is filled between the circuit board and the heat sink to cover the electronic component. The circuit board has through-holes. At least a portion of each through-hole is formed in a bonding range, to which the thermal gel is bonded. The through-holes enable visual recognition of the thermal gel through the through-holes.
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Inventors:
Takahiro Yamanaka
Nishimura Toshiro
Nishimura Toshiro
Application Number:
JP2015110602A
Publication Date:
December 27, 2017
Filing Date:
May 29, 2015
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L23/36; H01L23/40; H05K7/20
Domestic Patent References:
| JP2012256792A | ||||
| JP2007329338A | ||||
| JP2008091366A | ||||
| JP2003234585A | ||||
| JP10256441A | ||||
| JP2011023459A | ||||
| JP4296098A | ||||
| JP2009188182A | ||||
| JP2001068607A |
Attorney, Agent or Firm:
Masaki Hattori
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