Title:
A manufacturing method of electronic equipment and electronic equipment
Document Type and Number:
Japanese Patent JP6024297
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic apparatus which has excellent heat radiation efficiency of a heating component and inhibits local increase of a surface temperature of a housing body.SOLUTION: An electronic apparatus 100 includes: a housing 40; a circuit board P; and a heat conduction sheet 101. The circuit board P is attached to the interior of the housing 40. Electronic components 50, 51, 52, 53 are mounted on the circuit board P, and metal cases 61, 62 are attached onto the circuit board P. The heat conduction sheet 101 includes: enclosing parts 110, 111, 112; and a plane part 120. On the heat conduction sheet 101, the enclosing parts 110, 111, 112 protrude to the circuit board P side relative to the plane part 120. Surfaces of the enclosing parts 110, 111, 112 at the circuit board P side are joined to the electronic component 51 and the metal cases 61, 62. A surface of the heat conduction sheet 101 which is opposite to the circuit board P is joined to an inner surface of the housing 40.
Inventors:
Yasuhiro Tamaya
Application Number:
JP2012189934A
Publication Date:
November 16, 2016
Filing Date:
August 30, 2012
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K7/20; H01L23/373; H04M1/02
Domestic Patent References:
| JP10229287A | ||||
| JP11312883A | ||||
| JP201269902A | ||||
| JP2003289191A | ||||
| JP2003218565A | ||||
| JP2006245523A | ||||
| JP2008041756A |
Attorney, Agent or Firm:
Kaede International Patent Office