Title:
A manufacturing method of electronic equipment and electronic equipment
Document Type and Number:
Japanese Patent JP6205031
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a durable electronic apparatus and a manufacturing method of the electronic apparatus.SOLUTION: The electronic apparatus includes: an electronic component 2 which has an electrode on the rear surface; and a wiring board 5 which is formed with a wiring 4 on the surface of a flexible insulation base material 3. The electronic component 2 is fixed to the wiring board 5 by means of a resin 6. In the electronic apparatus, the outer edge shape of the resin 6 has a corner the angle of which is 90 degree or less in a part positioned on the wiring 4. With this structure, a high durability is obtained.SELECTED DRAWING: Figure 1
Inventors:
Yasushi Doso
Application Number:
JP2016152582A
Publication Date:
September 27, 2017
Filing Date:
August 03, 2016
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L21/60; H01L31/048; H01L31/068
Domestic Patent References:
| JP10173301A | ||||
| JP2271544A | ||||
| JP2009088145A | ||||
| JP2006190989A |
Foreign References:
| WO2012057076A1 |
Attorney, Agent or Firm:
Hiroyuki Katata
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