Title:
A manufacturing method of electronic parts and electronic parts, and a manufacturing method of an electronic device
Document Type and Number:
Japanese Patent JP6191121
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic device of high connection reliability by suppressing connection failure between electronic components.SOLUTION: An electronic component 10 includes a body 11 and a terminal 12 formed thereon. The terminal 12 includes a columnar electrode layer 13 having a protrusion 13a, a barrier layer 14 formed on the electrode layer 13, and a solder layer 15 formed on the barrier layer 14. When bonding the electronic component 10 to other electronic component, the electronic component 10 is made to face the other electronic component, and while heating the solder layer 15 at the fusion temperature, a protrusion 12a of the terminal 12 is brought into contact with a terminal of the other electronic component, so as to grow an intermetallic compound containing the component of the solder layer 15, thus bonding both terminals.
Inventors:
Morita
Nobuhiro Imaizumi
Nobuhiro Imaizumi
Application Number:
JP2012237551A
Publication Date:
September 06, 2017
Filing Date:
October 29, 2012
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K3/34; H01L21/60; H01L23/12; H05K1/18
Domestic Patent References:
| JP7142488A | ||||
| JP10270498A | ||||
| JP2011029636A | ||||
| JP2014017454A |
Attorney, Agent or Firm:
Takeshi Hattori