Title:
A manufacturing method of a film for semiconductor wafer protection, and a semiconductor device
Document Type and Number:
Japanese Patent JP6051302
Kind Code:
B2
Abstract:
According to the present invention, there is provided a semiconductor wafer protective film including a substrate layer (A) and an adhesive layer (C) formed on the substrate layer (A) , in which the substrate layer (A) includes polymer, and a solubility parameter of the polymer determined by a Van Krevelen method is equal to or greater than 9.
Inventors:
Tetsumitsu Morimoto
Makoto Kataoka
Hideki Fukumoto
Makoto Kataoka
Hideki Fukumoto
Application Number:
JP2015519819A
Publication Date:
December 27, 2016
Filing Date:
May 22, 2014
Export Citation:
Assignee:
Mitsui Chemicals Tohcello Co., Ltd.
International Classes:
H01L21/301; C09J7/29; C09J133/00; H01L21/304
Domestic Patent References:
| JP2009177033A | 2009-08-06 | |||
| JP2004043760A | 2004-02-12 | |||
| JP2003338475A | 2003-11-28 | |||
| JP2011195840A | 2011-10-06 | |||
| JP2005053998A | 2005-03-03 | |||
| JP2011228502A | 2011-11-10 | |||
| JP2013098408A | 2013-05-20 | |||
| JP2010258426A | 2010-11-11 | |||
| JPH0532946A | 1993-02-09 |
Attorney, Agent or Firm:
Shinji Hayami
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