Manufacturing method of hybrid integrated circuit board and hybrid integrated circuit board using it

Title:

Manufacturing method of hybrid integrated circuit board and hybrid integrated circuit board using it

Document Type and Number:

Japanese Patent JP6316610

Kind Code:

B2

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Inventors:

Honma Sao
Kenji Miyata
Takeshi Miyagawa

Application Number:

JP2014020753A

Publication Date:

April 25, 2018

Filing Date:

February 05, 2014

Export Citation:

Assignee:

Denka Co., Ltd.

International Classes:

H05K3/46; H01L23/12; H01L23/36

Domestic Patent References:

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