Title:
A manufacturing method of a liquid cooling integral-type board
Document Type and Number:
Japanese Patent JP6082512
Kind Code:
B2
Abstract:
There is provide a liquid-cooled integrated substrate which has reduced material cost and processing cost, is reduced in warpage (shape deformation) as an integrated substrate, and has excellent strength and heat radiation performance, and a manufacturing method of the liquid-cooled integrated substrate. There is provided a liquid-cooled integrated substrate 1 in which a metal circuit board 15 made of aluminum or an aluminum alloy is bonded to one surface of a ceramic substrate 10, one surface of a plate-like metal base plate 20 made of aluminum or an aluminum alloy is bonded to another surface of the ceramic substrate 10, and a liquid-cooling type radiator 30 composed of an extrusion material is bonded to another surface of the metal base plate 20, wherein a relation between a thickness t1 of the metal circuit board 15 and a thickness t2 of the metal base plate 20 satisfies t2/t1 § 2 where the thickness t1 of the metal circuit board 15 is 0.4 to 3 mm and the thickness t2 of the metal base plate 20 is 0.8 to 6 mm.
Inventors:
Hisashi Hori
Takanori Kokubo
Hideyo Koyamauchi
Takayuki Takahashi
Kunihiko Chihara
Takanori Kokubo
Hideyo Koyamauchi
Takayuki Takahashi
Kunihiko Chihara
Application Number:
JP2011004429A
Publication Date:
February 15, 2017
Filing Date:
January 12, 2011
Export Citation:
Assignee:
NIPPON LIGHT METAL COMPANY,LTD.
DOWA Metal Tech Co., Ltd.
DOWA Metal Tech Co., Ltd.
International Classes:
H01L23/36; H01L23/473; H01L25/07; H01L25/18; H05K1/02; H05K3/38
Domestic Patent References:
| JP200767258A | ||||
| JP2009260058A | ||||
| JP8208359A | ||||
| JP2005252136A | ||||
| JP2006114641A | ||||
| JP2008117833A | ||||
| JP2004235503A | ||||
| JP200511983A | ||||
| JP5876654B2 |
Foreign References:
| WO2009116439A1 |
Attorney, Agent or Firm:
Koji Hagiwara
Tetsuo Kanamoto
Miaki Kametani
Tetsuo Kanamoto
Miaki Kametani