Title:
A manufacturing method of a luminescent device
Document Type and Number:
Japanese Patent JP6043382
Kind Code:
B2
Abstract:
A method of manufacturing a light emitting device is provided which requires low cost, is easy, and has high throughput. The method of manufacturing a light emitting device is characterized in that: a solution containing a light emitting material is ejected to an anode or cathode under reduced pressure; a solvent in the solution is volatilized until the solution reaches the anode or cathode; and the remaining light emitting material is deposited on the anode or cathode to form a light emitting layer. A burning step for reduction in film thickness is not required after the solution application. Therefore, the manufacturing method, which requires low cost and is easy but which has high throughput, can be provided.
Inventors:
Shunpei Yamazaki
Takashi Hamada
Tetsushi Seo
Takashi Hamada
Tetsushi Seo
Application Number:
JP2015037873A
Publication Date:
December 14, 2016
Filing Date:
February 27, 2015
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
H05B33/10; H01L51/00; H01L51/40; H01L51/50; H01L51/56
Domestic Patent References:
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| JP10202153A | ||||
| JP2001300394A | ||||
| JP2001308082A | ||||
| JP2000237672A | ||||
| JP2001291588A | ||||
| JP2000290566A | ||||
| JP200535087A | ||||
| JP200431201A | ||||
| JP2004327272A |
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