A manufacturing method and a manufacture device of a semiconductor device

Title:

A manufacturing method and a manufacture device of a semiconductor device

Document Type and Number:

Japanese Patent JP6104192

Kind Code:

B2

Inventors:

▲高▼田誠
Junji Kobayashi
Nozomi Yasunaga
Takashi Sawai
Uchino Gen
Fumihisa Yamamoto

Application Number:

JP2014027807A

Publication Date:

March 29, 2017

Filing Date:

February 17, 2014

Export Citation:

Assignee:

Mitsubishi Electric Corporation

International Classes:

H01L21/304

Domestic Patent References:

Attorney, Agent or Firm:

Hiroaki Sakai

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