Title:
A manufacturing method of the metal pattern of the three-dimensional structure
Document Type and Number:
Japanese Patent JP6239647
Kind Code:
B2
Abstract:
The present application relates to a method of preparing a metal pattern having a 3D structure, a metal pattern laminate, and use of the metal pattern laminate. According to the method of preparing a metal pattern, the metal pattern having a 3D structure can be effectively formed on a receptor. Especially, the metal pattern having a 3D structure can also be effectively and rapidly transferred to a surface of the receptor, such as, a flexible substrate, to which the metal pattern is not easily transferred. The metal pattern laminate prepared using the method can, for example, be usefully used for metal layers of flexible electronic devices or metal interconnection lines.
Inventors:
Jin Mi Jun
Jae Jin Kim
John Ho Park
Boo Gong Shin
Jae Jin Kim
John Ho Park
Boo Gong Shin
Application Number:
JP2015549289A
Publication Date:
November 29, 2017
Filing Date:
August 01, 2014
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
B32B38/18; B32B15/04; H01L51/50; H05B33/10; H05B33/26; H05K3/20
Domestic Patent References:
| JP2009545853A | ||||
| JP2013140800A | ||||
| JP2010533977A | ||||
| JP2009544169A | ||||
| JP2005085799A | ||||
| JP2005079472A | ||||
| JP2003077651A |
Attorney, Agent or Firm:
Shinya Mitsuhiro
Takashi Watanabe
Takashi Watanabe