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Title:
METAL FOIL WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, ELECTRONIC DEVICE, MANUFACTURING METHOD OF METAL FOIL WITH CARRIER AND MANUFACTURING METHOD OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2016193524
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a metal foil with a carrier high in adhesive force between the carrier and a metal layer before a laminating process to an insulation substrate, having no extreme increase or decrease of adhesion property between the carrier and the metal layer by the laminating process to the insulation substrate, and capable of easily peeling carrier/metal layer.SOLUTION: There is provided a metal foil with a carrier having the carrier, a first intermediate layer containing oxygen and a metal layer in this order and having average of depth from a surface of a first intermediate layer side of the peeled carrier till oxygen at 10 locations becomes 10 at% or less in terms of SiOof 0.5 nm to 15 nm and standard deviation/average value of 0.6 or less when the carrier of the metal foil with the carrier is peeled according to JIS C 6471 and analysis in a depth direction by XPS is conducted for total 10 locations of 5 locations with 20 mm interval in a width direction (TD direction) of the metal foil of the carrier and 5 locations with 20 mm interval in a longer direction (MD direction).SELECTED DRAWING: Figure 5

Inventors:
SHIBUYA YOSHITAKA
NAGAURA YUTA
HONDA MISATO
MAENISHIHARA OSAMU
Application Number:
JP2015074034A
Publication Date:
November 17, 2016
Filing Date:
March 31, 2015
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
B32B15/01; B32B15/04; C23C28/00; C25D1/04; C25D1/22; H05K1/09
Attorney, Agent or Firm:
Axis International Patent Business Corporation