A manufacturing method of a multilayer printed wiring board

Title:

A manufacturing method of a multilayer printed wiring board

Document Type and Number:

Japanese Patent JP6281489

Kind Code:

B2

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Inventors:

Ryo Miyamoto
Hirohisa Narahashi
Shigeo Nakamura

Application Number:

JP2014516852A

Publication Date:

February 21, 2018

Filing Date:

May 23, 2013

Export Citation:

Assignee:

AJINOMOTO CO.,LTD.

International Classes:

H05K3/46

Domestic Patent References:

Foreign References:

WO2010047411A1

Attorney, Agent or Firm:

Hiroaki Sakai
Takuya Kashima

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