Title:
A manufacturing method of a multilevel interconnection board and a multilevel interconnection board
Document Type and Number:
Japanese Patent JP6036837
Kind Code:
B2
Abstract:
A multilayer wiring board has a central wiring layer disposed in the center of an odd number of wiring layers, insulating layers and wiring layers disposed above and below the central wiring layer, respectively, an interlayer connections having cross-sectionally trapezoidal shapes and penetrating the insulating layers to establish interlayer connection between the wiring layers. The interlayer connection is disposed to connect to a portion below the central wiring layer. The interlayer connection is disposed to connect to a portion above the central wiring layer. The directions of tapers of the cross-sectionally trapezoidal shapes of the interlayer connections are identical.
Inventors:
Takanori Nishida
Ushiyama Yuji
Ushiyama Yuji
Application Number:
JP2014538599A
Publication Date:
November 30, 2016
Filing Date:
September 26, 2013
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H05K3/46; H01L23/12
Domestic Patent References:
| JP2011199077A | ||||
| JP2011129563A | ||||
| JP2009088464A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Tomoya Furoshita
High Kunio Ki
Yoshinori Shimizu
Tomoya Furoshita
High Kunio Ki
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