Manufacturing method of multi-layer wiring board - Nippon Special Ceramics Co., Ltd.

Title:

Manufacturing method of multi-layer wiring board

Document Type and Number:

Japanese Patent JP6366562

Kind Code:

B2

Inventors:

Yoshiaki Nagaya
Taku Miyamoto
Yutaka Imanishi
Muneyuki Iwata
Naoko Mori

Application Number:

JP2015220003A

Publication Date:

August 01, 2018

Filing Date:

November 10, 2015

Export Citation:

Assignee:

Nippon Special Ceramics Co., Ltd.

International Classes:

H05K3/46

Domestic Patent References:

Attorney, Agent or Firm:

Suzuki Manabu

Previous Patent: A soldering apparatus and a soldering method

Next Patent: JPS6366563