Title:
光半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5583703
Kind Code:
B2
Abstract:
The present invention is a UV-curable adhesive silicone composition includes: (A) an organopolysiloxane having a resin structure consisting of R 1 SiO 3/2 , R 2 2 SiO 2/2 , and R 3 a R 4 b SiO (4-a-b)/2 units, wherein R 4 represents a vinyl group or an allyl group, wherein 5 to 300 R 2 2 SiO 2/2 units are continuously repeated, (B) an organohydrogenpolysiloxane having a resin structure consisting of R 1 SiO 3/2 , R 2 2 SiO 2/2 , and R 3 c H d SiO (4-c-d)/2 units, wherein 5 to 300 R 2 2 SiO 2/2 units are continuously repeated, and (C) a photoactive catalyst, wherein the UV-curable adhesive silicone composition is in a plastic solid state or a semi-solid state in an uncured state at room temperature. Thereby, there can be provided a UV-curable adhesive silicone composition that is in a plastic solid state or a semi-solid state in an uncured state at room temperature and therefore easy to handle, can uniformly disperse a phosphor and cover a surface of an LED chip, and can readily form a cured layer only on a necessary portion.
Inventors:
Tsutomu Kashiwagi
Toshio Shiobara
Toshio Shiobara
Application Number:
JP2012007890A
Publication Date:
September 03, 2014
Filing Date:
January 18, 2012
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08G77/12; H01L23/29; C08G77/20; C08L83/05; C08L83/07; C09J183/05; C09J183/07; H01L23/31
Attorney, Agent or Firm:
Good Miya Mikio