Title:
A manufacturing method of the organic electronic device using an adhesive constituent, an adhesion film, and this
Document Type and Number:
Japanese Patent JP6277275
Kind Code:
B2
Abstract:
Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
Inventors:
Yong Kyun Cho
Kyun Yuru Bae
Min Su Park
Jun Sup Sim
Hyun Ji Yu
Kyun Yuru Bae
Min Su Park
Jun Sup Sim
Hyun Ji Yu
Application Number:
JP2016533239A
Publication Date:
February 07, 2018
Filing Date:
August 05, 2014
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
C09J109/00; C09J4/02; C09J7/10; C09J7/20; C09J11/04; C09J11/06; H01L51/50; H05B33/04; H05B33/10
Domestic Patent References:
| JP10046125A | ||||
| JP2011236298A | ||||
| JP2013075978A | ||||
| JP2012140578A | ||||
| JP2012140579A | ||||
| JP2004105369A | ||||
| JP2005261453A | ||||
| JP2011526052A | ||||
| JP2011522063A |
Foreign References:
| WO2012081542A1 | ||||
| WO2013073846A1 | ||||
| WO2013103283A1 | ||||
| WO2013028047A1 | ||||
| US20110272827 |
Attorney, Agent or Firm:
Shinya Mitsuhiro
Takashi Watanabe
Takashi Watanabe
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