Title:
A photosensitive resin composition and a method for producing a pattern cured film using the photosensitive resin composition.
Document Type and Number:
Japanese Patent JP6364788
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that gives physical properties of a cured film comparable to those of a film cured at high temperature, that suppresses generation of a residue after development or has no residue, and exhibits good adhesiveness to copper, and a production method of a patterned cured film using the photosensitive resin composition.SOLUTION: The photosensitive resin composition comprises (s) a polybenzoxazole precursor having a structural unit represented by formula (I) below, (b) a photosensitizer, (c) a crosslinking agent, (d) 2-mercapto benzoxazole or its derivative, (e) tetrazole or its derivative, and a solvent. In formula (I), Rand Reach independently represent a hydrogen atom, a fluorine atom, an alkyl group having 1 to 6 carbon atoms, or a fluorinated alkyl group having 1 to 6 carbon atoms; a represents an integer of 1 to 30; U and W each independently represent a single bond or a divalent group; X represents a divalent group; j and k represent molar fractions of A structural unit and of B structural unit, respectively, and j is 40 to 80 mol%, and k is 20 to 60 mol%, where the sum of j and k is 100 mol%.
Inventors:
Yuki Nakamura
Minegishi Tomonori
Keiji Ono
Masayuki Oe
Motobu Takeharu
Noritaka Matsuya
Minegishi Tomonori
Keiji Ono
Masayuki Oe
Motobu Takeharu
Noritaka Matsuya
Application Number:
JP2014014713A
Publication Date:
August 01, 2018
Filing Date:
January 29, 2014
Export Citation:
Assignee:
Hitachi Chemical DuPont Micro Systems Co., Ltd.
International Classes:
G03F7/004; C08G69/26; G03F7/023; G03F7/40
Domestic Patent References:
| JP2010096927A | ||||
| JP2007017959A | ||||
| JP2013256603A | ||||
| JP2008535003A |
Foreign References:
| US20100099043 |
Attorney, Agent or Firm:
Heiwa International Patent Office