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Title:
The manufacturing method, the plating liquid, and the nano device of the electrode structure of having nano gap length
Document Type and Number:
Japanese Patent JP5942297
Kind Code:
B2
Abstract:
A substrate 1 having metal layers 2A and 2B arranged to form a gap is dipped in an electroless plating solution mixed an electrolyte solution including metal ions with a reducing agent and a surfactant. Metal ions are reduced by the reducing agent to be precipitated on the metal layers 2A and 2B, and the surfactant is adhered to a surface of the metal on the metal layers, thereby forming a pair of electrodes 4A, 4B to be controlled to have a nanometer sized gap. These steps enable to provide a method for fabricating nanogap electrodes, a nanogap electrodes array, and a nanodevice with the same.

Inventors:
Yutaka Mashima
Toshiharu Teranishi
Taro Muraki
Daisuke Tanaka
Application Number:
JP2013503464A
Publication Date:
June 29, 2016
Filing Date:
February 28, 2012
Export Citation:
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Assignee:
Japan Science and Technology Agency
International Classes:
H01L21/288; B82Y30/00; B82Y40/00; H01L29/06; H01L29/66; H01L29/786
Domestic Patent References:
JP2008192712A2008-08-21
JP2006234799A2006-09-07
JP2010245471A2010-10-28
JP2005513818A2005-05-12
JP2009535837A2009-10-01
JP2006209982A2006-08-10
JP2008192712A2008-08-21
JP2006234799A2006-09-07
JP2010245471A2010-10-28
JP2005513818A2005-05-12
JP2009535837A2009-10-01
Other References:
JPN7012001166; Ｙｕｈｓｕｋｅ　Ｙａｓｕｔａｋｅ　ｅｔ　ａｌ．: 'Ｓｉｍｕｌｔａｎｅｏｕｓ　ｆａｂｒｉｃａｔｉｏｎ　ｏｆ　ｎａｎｏｇａｐ　ｇｏｌｄ　ｅｌｅｃｔｒｏｄｅｓ　ｂｙ　ｅｌｅｃｔｒｏｌｅｓｓ　ｇｏｌｄ　ｐｌａｔｉｎｇ　ｕｓｉｎｇ　ａ　ｃｏｍｍｏｎ　ｍｅｄｉｃ' ＡＰＰＬＩＥＤ　ＰＨＹＳＩＣＳ　ＬＥＴＴＥＲＳ Ｖｏｌ．９１, 2007, Ｐ．２０３１０７
JPN7012001166; Ｙｕｈｓｕｋｅ　Ｙａｓｕｔａｋｅ　ｅｔ　ａｌ．: 'Ｓｉｍｕｌｔａｎｅｏｕｓ　ｆａｂｒｉｃａｔｉｏｎ　ｏｆ　ｎａｎｏｇａｐ　ｇｏｌｄ　ｅｌｅｃｔｒｏｄｅｓ　ｂｙ　ｅｌｅｃｔｒｏｌｅｓｓ　ｇｏｌｄ　ｐｌａｔｉｎｇ　ｕｓｉｎｇ　ａ　ｃｏｍｍｏｎ　ｍｅｄｉｃ' ＡＰＰＬＩＥＤ　ＰＨＹＳＩＣＳ　ＬＥＴＴＥＲＳ Ｖｏｌ．９１, 2007, Ｐ．２０３１０７
Attorney, Agent or Firm:
Kazuyuki Hirayama



 
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